MMF006630 related parameters_MMF006630 PDF documentation_Micro-Measurements (Division of Vishay Precision Group)

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In Stock：19,846(Ref. price)

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Specifications

Description	Details
Series	-
Package	Jar
Type	Solder Paste
Composition	Ag40Cu30Zn28Ni2 (40/30/28/2)
Diameter	-
Melting Point	1220 ~ 1435°F (660 ~ 780°C)
Flux Type	-
Wire Gauge	-
Process	Lead Free
Form	Jar, 1 oz (28g)
Shelf Life	9 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	41°F ~ 77°F (5°C ~ 25°C)

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