26-5050-8813 related parameters_26-5050-8813 PDF documentation_Kester Solder

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Specifications

Description	Details
Series	245
Package	Bulk
Type	Wire Solder
Composition	Sn50Pb50 (50/50)
Diameter	0.040" (1.02mm)
Melting Point	361 ~ 420°F (183 ~ 216°C)
Flux Type	No-Clean
Wire Gauge	18 AWG, 19 SWG
Process	Leaded
Form	Spool, 5 lbs (2.27kg)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	50°F ~ 104°F (10°C ~ 40°C)

Other

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