SMD2016 related parameters_SMD2016 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	SMD2
Package	Bulk
Type	Solder Sphere
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	0.008" (0.20mm)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	-
Wire Gauge	-
Process	Lead Free
Form	Jar
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-

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