SMD291SNL250T5 related parameters_SMD291SNL250T5 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	-
Package	Jar
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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