NC191LTA35 related parameters_NC191LTA35 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	Smooth Flow™
Package	Bulk
Type	Solder Paste
Composition	Bi57Sn42Ag1 (57/42/1)
Diameter	-
Melting Point	279°F (137°C)
Flux Type	No-Clean
Wire Gauge	-
Process	-
Form	Syringe, 1.23 oz (35g), 10cc
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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