NC191LT250T5 related parameters_NC191LT250T5 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	Smooth Flow™
Package	Bulk
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	280°F (138°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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