CQ100GE.031 1LB related parameters_CQ100GE.031 1LB PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Diameter	0.031" (0.79mm)
Melting Point	441°F (227°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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