XCZU7EV-3FBVB900E related parameters_XCZU7EV-3FBVB900E PDF documentation_Xilinx Inc.

System On Chip (SoC)

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Specifications

Description	Details
Series	Zynq® UltraScale+™ MPSoC EV
Package	Tray
Architecture	MCU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size	-
RAM Size	256KB
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	600MHz, 1.5GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package / Case	900-BBGA, FCBGA
Supplier Device Package	900-FCBGA (31x31)

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