558-10-357M19-001101 related parameters_558-10-357M19-001101 PDF documentation_Preci-Dip

Sockets for ICs Transistors

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Specifications

Description	Details
Series	558
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	357 (19 x 19)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

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