1814655-9 related parameters_1814655-9 PDF documentation_TE Connectivity AMP Connectors

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	16 (1 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	29.5µin (0.75µm)
Contact Material - Post	Brass
Housing Material	Thermoplastic, Polyester
Operating Temperature	-55°C ~ 125°C

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