24-5050-0069 related parameters_24-5050-0069 PDF documentation_Kester Solder

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Specifications

Description	Details
Series	44
Package	Bulk
Type	Wire Solder
Composition	Sn50Pb50 (50/50)
Diameter	0.125" (3.18mm)
Melting Point	361 ~ 420°F (183 ~ 216°C)
Flux Type	Rosin Activated (RA)
Wire Gauge	8 AWG, 10 SWG
Process	Leaded
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	50°F ~ 104°F (10°C ~ 40°C)

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