24-7050-8808 related parameters_24-7050-8808 PDF documentation_Kester Solder

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Specifications

Description	Details
Series	245
Package	Bulk
Type	Wire Solder
Composition	Sn96.3Ag3.7 (96.3/3.7)
Diameter	0.020" (0.51mm)
Melting Point	430 ~ 444°F (221 ~ 223°C)
Flux Type	No-Clean
Wire Gauge	24 AWG, 25 SWG
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	50°F ~ 104°F (10°C ~ 40°C)

Other

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