TS391SNL50 related parameters_TS391SNL50 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 1.76 oz (50g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)

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