NC191AX250T5 related parameters_NC191AX250T5 PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	Smooth Flow™
Package	Bulk
Type	Solder Paste
Composition	Sn63Pb37 (63/37)
Diameter	-
Melting Point	361°F (183°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Leaded
Form	Jar, 8.8 oz (250g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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