SMDIN97AG3 related parameters_SMDIN97AG3 PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	SMD
Package	Bulk
Type	Wire Solder
Composition	In97Ag3 (97/3)
Diameter	0.031" (0.79mm)
Melting Point	289°F (143°C)
Flux Type	-
Wire Gauge	20 AWG, 21 SWG
Process	Lead Free
Form	Spool
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-

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