NC3SWLF.031 0.5OZ related parameters_NC3SWLF.031 0.5OZ PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn96.5Ag3.5 (96.5/3.5)
Diameter	0.031" (0.79mm)
Melting Point	430°F (221°C)
Flux Type	No-Clean
Wire Gauge	20 AWG, 21 SWG
Process	-
Form	Tube, 0.50 oz (14.17g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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