NC2SWLF.031 1LB related parameters_NC2SWLF.031 1LB PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn99.3Cu0.7 (99.3/0.7)
Diameter	0.031" (0.79mm)
Melting Point	441°F (227°C)
Flux Type	No-Clean
Wire Gauge	20 AWG, 21 SWG
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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Price advantage, NC2SWLF.031 1LB is available in stock and can be delivered on the same day

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