BGA0033 related parameters_BGA0033 PDF documentation_Chip Quik Inc.

Adapter、 Breakout Boards

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Specifications

Description	Details
Series	Proto-Advantage
Package	Bulk
Proto Board Type	SMD to Plated Through Hole Board
Package Accepted	BGA
Number of Positions	144
Pitch	0.020"" (0.50mm)
Board Thickness	0.063"" (1.60mm)
Material	FR4 Epoxy Glass
Size / Dimension	2.100"" L x 2.000"" W (53.34mm x 50.80mm)

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