BGA0034 related parameters_BGA0034 PDF documentation_Chip Quik Inc.

Adapter、 Breakout Boards

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Specifications

Description	Details
Series	Proto-Advantage
Package	Bulk
Proto Board Type	SMD to Plated Through Hole Board
Package Accepted	BGA
Number of Positions	-
Pitch	0.039"" (1.00mm)
Board Thickness	0.063"" (1.60mm)
Material	FR4 Epoxy Glass
Size / Dimension	4.400"" L x 3.500"" W (111.76mm x 88.90mm)

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