M2S060-FGG676 related parameters_M2S060-FGG676 PDF documentation_Microchip Technology

System On Chip (SoC)

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Specifications

Description	Details
Series	SmartFusion®2
Package	Tray
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	256KB
RAM Size	64KB
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz
Primary Attributes	FPGA - 60K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)
Package / Case	676-BGA
Supplier Device Package	676-FBGA (27x27)

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