A2F060M3E-1FGG256I related parameters_A2F060M3E-1FGG256I PDF documentation_Microsemi Corporation

System On Chip (SoC)

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Specifications

Description	Details
Series	SmartFusion®
Package	Tray
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	128KB
RAM Size	16KB
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I²C, SPI, UART/USART
Speed	100MHz
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	256-LBGA
Supplier Device Package	256-FPBGA (17x17)

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