XC7Z007S-2CLG225I related parameters_XC7Z007S-2CLG225I PDF documentation_Xilinx Inc.

System On Chip (SoC)

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Specifications

Description	Details
Series	Zynq®-7000
Package	Tray
Architecture	MCU, FPGA
Core Processor	Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size	-
RAM Size	256KB
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	766MHz
Primary Attributes	Artix™-7 FPGA, 23K Logic Cells
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	225-LFBGA, CSPBGA
Supplier Device Package	225-CSPBGA (13x13)

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