LPC11E35FHI33/501E related parameters_LPC11E35FHI33/501E PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	LPC11E3x
Package	Tray
Core Processor	ARM® Cortex®-M0
Core Size	32-Bit
Speed	50MHz
Connectivity	I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT
Number of I/O	26
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
EEPROM Size	4K x 8
RAM Size	12K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Data Converters	A/D 8x10b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	32-VFQFN Exposed Pad
Supplier Device Package	32-HVQFN (5x5)

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