LPC55S66JBD64K related parameters_LPC55S66JBD64K PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	LPC55S6x
Package	Tray
Core Processor	ARM® Cortex®-M33
Core Size	32-Bit
Speed	150MHz
Connectivity	Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	36
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	144K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Data Converters	A/D 10x16b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	64-TQFP Exposed Pad
Supplier Device Package	64-HTQFP (10x10)

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