TMPM3H2FSQG,A,EL related parameters_TMPM3H2FSQG,A,EL PDF documentation_Toshiba Semiconductor and Storage

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Specifications

Description	Details
Series	-
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3
Core Size	32-Bit
Speed	40MHz
Connectivity	I²C, SPI, UART/USART
Peripherals	DMA, LVD, POR, WDT
Number of I/O	40
Program Memory Size	16KB (16K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	8K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V
Data Converters	A/D 8x12b; D/A 1x8b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	48-VFQFN Exposed Pad
Supplier Device Package	48-VQFN (6x6)

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