SP5744BSK1AMMH6R related parameters_SP5744BSK1AMMH6R PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	MPC57xx
Package	Tape & Reel (TR)
Core Processor	e200z4
Core Size	32-Bit
Speed	160MHz
Connectivity	CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals	DMA, I²S, POR, WDT
Number of I/O	65
Program Memory Size	1.5MB (1.5M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	192K x 8
Voltage - Supply (Vcc/Vdd)	3.15V ~ 5.5V
Data Converters	A/D 36x10b, 16x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	100-LFBGA
Supplier Device Package	100-MAPBGA (11x11)

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