HSET860-BGA-1 related parameters_HSET860-BGA-1 PDF documentation_iBASE Technology

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Box
Type	Top Mount
Package Cooled	ET860
Attachment Method	-
Shape	-
Length	-
Width	-
Diameter	-
Fin Height	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	-
Material	-
Material Finish	-

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