HSS-B20-NP-02 related parameters_HSS-B20-NP-02 PDF documentation_CUI Devices

Thermal - Heat Sinks

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Specifications

Description	Details
Series	HSS
Package	Bag
Type	Board Level
Package Cooled	TO-220
Attachment Method	-
Shape	Rectangular, Fins
Length	0.748" (19.00mm)
Width	0.830" (21.08mm)
Diameter	-
Fin Height	0.394" (10.00mm)
Power Dissipation @ Temperature Rise	3.6W @ 75°C
Thermal Resistance @ Forced Air Flow	5.39°C/W @ 200 LFM
Thermal Resistance @ Natural	20.59°C/W
Material	Aluminum
Material Finish	Black Anodized

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