HS-ZX-R1-SET-R1 related parameters_HS-ZX-R1-SET-R1 PDF documentation_Enclustra FPGA Solutions

Thermal - Heat Sinks

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In Stock：20,616(Ref. price)

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Specifications

Description	Details
Series	Mars ZX2, ZX3
Package	Bag
Type	Top Mount
Package Cooled	FPGA
Attachment Method	-
Shape	-
Length	-
Width	-
Diameter	-
Fin Height	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	-
Material	-
Material Finish	-

Other

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