HSS-B20-NP-01 related parameters_HSS-B20-NP-01 PDF documentation_CUI Devices

Thermal - Heat Sinks

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Specifications

Description	Details
Series	HSS
Package	Bag
Type	Board Level
Package Cooled	TO-220
Attachment Method	-
Shape	Rectangular, Fins
Length	0.787" (20.00mm)
Width	0.775" (19.68mm)
Diameter	-
Fin Height	0.303" (7.70mm)
Power Dissipation @ Temperature Rise	4.1W @ 75°C
Thermal Resistance @ Forced Air Flow	7.05°C/W @ 200 LFM
Thermal Resistance @ Natural	18.29°C/W
Material	Aluminum
Material Finish	Black Anodized

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