BDN15-3CB/A01 related parameters_BDN15-3CB/A01 PDF documentation_CTS Thermal Management Products

Thermal - Heat Sinks

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Specifications

Description	Details
Series	BDN
Package	Box
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Pin Fins
Length	1.510" (38.35mm)
Width	1.510" (38.35mm)
Diameter	-
Fin Height	0.355" (9.02mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 400 LFM
Thermal Resistance @ Natural	15.10°C/W
Material	Aluminum
Material Finish	Black Anodized

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