TBL006V-500-04GY-2GY related parameters_TBL006V-500-04GY-2GY PDF documentation_CUI Devices

Wire to Board

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Specifications

Description	Details
Series	TBL006V-500
Package	Box
Number of Levels	1
Positions Per Level	4
Pitch	0.197" (5.00mm)
Mating Orientation	Vertical with Board
Current	10 A
Voltage	300 V
Wire Gauge	16-20 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Push Button Clamp
Features	Interlocking (Side), Push Button Actuated
Color	Gray

Other

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