TBL007A-500-11GY related parameters_TBL007A-500-11GY PDF documentation_CUI Devices

Wire to Board

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Specifications

Description	Details
Series	TBL007A-500
Package	Tray
Number of Levels	1
Positions Per Level	11
Pitch	0.197" (5.00mm)
Mating Orientation	45° (135°) Angle with Board
Current	15 A
Voltage	300 V
Wire Gauge	14-26 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Spring Cage, Tension Clamp
Features	Interlocking (Side)
Color	Gray

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