TBL008V-1000-11BE related parameters_TBL008V-1000-11BE PDF documentation_CUI Devices

Wire to Board

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Specifications

Description	Details
Series	TBL008V-1000
Package	Box
Number of Levels	1
Positions Per Level	11
Pitch	0.394" (10.00mm)
Mating Orientation	Vertical with Board
Current	66 A
Voltage	600 V
Wire Gauge	4-18 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Spring Cage, Tension Clamp
Features	Interlocking (Side)
Color	Blue

Other

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