558-10-560M33-001104 related parameters_558-10-560M33-001104 PDF documentation_Preci-Dip

Sockets for ICs Transistors

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Specifications

Description	Details
Series	558
Package	Bulk
Type	BGA
Number of Positions or Pins (Grid)	560 (33 x 33)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Brass
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

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