2-1437542-2 related parameters_2-1437542-2 PDF documentation_TE Connectivity AMP Connectors

Sockets for ICs Transistors

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Specifications

Description	Details
Series	700
Package	-
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole, Right Angle, Vertical
Features	Carrier, Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Beryllium Copper
Housing Material	Aluminum Alloy
Operating Temperature	-55°C ~ 125°C

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