916715-1 related parameters_916715-1 PDF documentation_TE Connectivity AMP Connectors

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	321 (19 x 19)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	15.0µin (0.38µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	15.0µin (0.38µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-

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