44-547-11 related parameters_44-547-11 PDF documentation_Aries Electronics

Sockets for ICs Transistors

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Specifications

Description	Details
Series	547
Package	Bulk
Type	SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid)	44 (2 x 22)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-

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