232-2601-00-0602 related parameters_232-2601-00-0602 PDF documentation_3M

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Textool™
Package	Bulk
Type	SIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	32 (1 x 32)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled
Operating Temperature	-55°C ~ 125°C

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