MHAS-181-ZMGG-15 related parameters_MHAS-181-ZMGG-15 PDF documentation_Samtec Inc.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	MHA
Package	Bulk
Type	BGA
Number of Positions or Pins (Grid)	181 (15 x 15)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	-
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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