511-91-155-16-003003 related parameters_511-91-155-16-003003 PDF documentation_Mill-Max Manufacturing Corp.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	511
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	155 (16 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C

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