551-10-223-18-095003 related parameters_551-10-223-18-095003 PDF documentation_Mill-Max Manufacturing Corp.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	551
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	223 (18 x 18)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	-
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-

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