84-537-21 related parameters_84-537-21 PDF documentation_Aries Electronics

Sockets for ICs Transistors

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Specifications

Description	Details
Series	537
Package	-
Type	PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid)	84 (4 x 21)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	12.0µin (0.30µm)
Contact Material - Mating	-
Mounting Type	Surface Mount
Features	Closed Frame
Termination	-
Pitch - Post	-
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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