550-80-121-13-061101 related parameters_550-80-121-13-061101 PDF documentation_Preci-Dip

Sockets for ICs Transistors

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Specifications

Description	Details
Series	550
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	121 (13 x 13)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

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