240-5205-01 related parameters_240-5205-01 PDF documentation_3M

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Textool™
Package	Bulk
Type	QFN
Number of Positions or Pins (Grid)	40 (4 x 10)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES)
Operating Temperature	-

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