510-13-100-13-062003 related parameters_510-13-100-13-062003 PDF documentation_Mill-Max Manufacturing Corp.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	510
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	100 (13 x 13)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C

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