614-83-225-17-061112 related parameters_614-83-225-17-061112 PDF documentation_Preci-Dip

Sockets for ICs Transistors

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Specifications

Description	Details
Series	614
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	225 (17 x 17)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Carrier, Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

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