10-8850-210C related parameters_10-8850-210C PDF documentation_Aries Electronics

Sockets for ICs Transistors

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Specifications

Description	Details
Series	8
Package	Bulk
Type	DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)	10 (2 x 5)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame, Elevated
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-55°C ~ 105°C

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