D0806-01 related parameters_D0806-01 PDF documentation_Harwin Inc.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	D0
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	6 (2 x 3)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Wire Wrap
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	196.9µin (5.00µm)
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature	-55°C ~ 125°C

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