29-0501-30 related parameters_29-0501-30 PDF documentation_Aries Electronics

Sockets for ICs Transistors

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Specifications

Description	Details
Series	501
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	29 (1 x 29)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	-
Termination	Wire Wrap
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-55°C ~ 105°C

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